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BinOptics
Introduces 1310nm Horizontal-Cavity Surface-Emitting Laser
ITHACA, NY – April 29, 2004 – BinOptics Corporation, a leader in the development of integrated microphotonic devices, announced today the availability of a new class of surface-emitting lasers manufactured using its proprietary etched facet technology platform. The new Horizontal Cavity Surface Emitting Laser (HCSEL) combines the power and high reliability of an edge-emitting laser with the low cost and ease of packaging of a vertical cavity surface-emitting laser (VCSEL). The BinOptics device integrates a horizontal laser cavity with a 45 degree etched reflecting mirror to direct the output beam vertically. The first product is a 1310nm Fabry-Perot (FP) laser designed for uncooled operation at data rates of 2.5 Gbps with an optical output power of 20 mW and a slope efficiency of up to 0.3 W/A. This product is available with or without an integrated monitoring photodetector (MPD). The BinOptics surface-emitting laser offers unparalleled value while filling the existing gap between long-wavelength VCSELs and conventional FP lasers.
The advantages of VCSELs operating at 850 nm were so compelling that VCSELs replaced all standard transmitters in local area networks within two years of first commercial availability. These benefits include on-wafer testing, the ability to fabricate one and two dimensional arrays on the same chip for easy coupling with fiber arrays or electronics, and side-by-side integration with detectors enabling low cost integrated transceivers. These advantages have not been realized for VCSELs at 1310 nm because of materials issues that lead to low power and poor yield, negating most of the cost benefits. The BinOptics 1310 nm HCSEL delivers all the above advantages and more. It uses proven edge-emitting materials and BinOptics’ unique etched facet technology to achieve a new level of cost-effectiveness and performance. In addition, it allows monolithic integration of the MPD to further reduce cost. The BinOptics HCSEL is designed to be the technology of choice for applications where cost and compact size are critical, such as Ethernet, Access, and PON.
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About BinOptics
Corporation
BinOptics manufactures
monolithically integrated laser chips based on its
proprietary Etched Facet Technology. This unique platform
allows the company to meet commercial requirements
with higher reproducibility, more flexibility for
product design and integration, significantly lower
cost, and higher performance than alternative processes.
The company's products address high growth datacom
applications, such as 10G Ethernet, parallel optical
interconnects, PON and CWDM, as well as advanced non-telecom
applications. Founded in November 2000, BinOptics
is privately held and funded by renowned Silicon Valley
venture firm
Draper
Fisher Jurvetson, the Cayuga
Venture Fund II and Stanford
University. The
company is located in the Cornell
Business & Technology Park in Ithaca, New York.
For product information, visit BinOptics' Web site at www.binoptics.com or contact Harvey Spreckman at sales@binoptics.com or 607-257-3200 x238.
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