BinOptics to Unveil Integrated PON Chip at OFC 2005

Ithaca, NY March 1, 2005 – BinOptics Corporation, an emerging leader in the development of integrated microphotonic devices, announced today that it will present a technical paper on its new integrated passive optical network (PON) diplexer chip at the Optical Fiber Communication Conference (OFC) in Anaheim, California. The paper describes how the company’s etched facet technology has been used to create a unique low cost solution for the PON ONU through the integration of BinOptics’ Horizontal Cavity Surface Emitting Laser (HCSEL™), a monitor photodetector (MPD) and a high speed receive detector. BinOptics lasers are produced without the use of regrowth or mechanical cleaving allowing monolithic integration of functions and wafer-scale testing. BinOptics is pleased to have its work selected for the OFC technical program, a rigorous, peer-reviewed process that recognizes work representing the highest degree of technical achievement in the optics industry.

”This OFC paper demonstrates the effectiveness of our etched facet technology to meet critical industry challenges with novel, low cost solutions,” said Alex Behfar, CEO of BinOptics. "Our integrated laser products are designed to meet the demanding requirements of today’s optical transceivers. The low cost PON diplexer chip presented in this paper will help drive the deployment of FTTH systems by providing a compact, easily packaged solution for the cost-sensitive ONU application”.

The paper by BinOptics is entitled “Monolithically Integrated Diplexer Chip for PON Applications” and is co-authored by Alex Behfar, Malcolm Green, Alan Morrow, Alfred Schremer, and Cristian Stagarescu. Designated OTuM5, it will be presented at 5:45pm on Tuesday, March 8, 2005. Interested parties can find out more about BinOptics' technology and product offerings by visiting Booth #1656 at the OFC Exposition, March 8-10, 2005.

___

About BinOptics Corporation

BinOptics manufactures monolithically integrated laser chips based on its proprietary etched facet technology. This unique platform allows the company to meet commercial requirements with higher reproducibility, more flexibility for product design and integration, significantly lower cost, and higher performance than alternative processes. The company's products address high growth datacom applications, parallel optical interconnects, PON and CWDM, as well as advanced non-telecom applications. Founded in November 2000, BinOptics is privately held and funded by FA Technology Ventures, ArrowPath Venture Capital, Draper Fisher Jurvetson, and Cayuga Venture Fund. The company is located in the Cornell Business & Technology Park in Ithaca, New York.

For more information, visit www.binoptics.com or contact Harvey Spreckman at sales@binoptics.com or 607-257-3200 x238.