BinOptics' surface-emitting laser design is based on its proprietary capability to etch smooth facets. In this case, the etching is performed at a 45º angle relative to the plane of the wafer, creating a precisely aligned mirror that reflects the laser beam vertically. Unlike VCSEL processing, the Horizontal Cavity Surface Emitting Laser (HCSEL) approach allows the laser cavity to be fabricated horizontally on the wafer using well-understood and reliable materials and processes.

As well as allowing great flexibility in laser wavelength including 1310nm and 1550nm, the cavity length can be designed for optimal performance, for example in high power applications. HCSELs share many of the same advantages as VCSELs. They can be packaged more cost effectively than edge emitters, allow side-by-side integration of receive detectors, and can be fabricated in two-dimensional arrays. In addition, HCSELs allow the monolithic integration of the MPD. The beam and LIV characteristics of HCSELs are similar to edge-emitting lasers.